EFUG presentations sorted by topic (since 2000)

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Topics

• Reviews
• FIB process and instrumentation
• Gas assisted processing
• Circuit edit
• Failure analysis
• TEM sample preparation
• Materials analysis
• Micro- and nanostructuring
• Bio and soft materials

FIB reviews

• Precise Ion and Electron Beam processing for Nano-structuring (EFUG2004)
  Regina Kortner, Hans Loeschner and Elmar Platzgummer, IMS Nanofabrication, Vienna, Austria
  
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• The Quest for Ultimate Patterning Tools and Techniques – Focused Ion Beams: Status Future Applications and New Ideas (EFUG2007)
  Jacques Gierak, Laboratoire de Photonique et de Nanostructures, CNRS Marcoussis, France
  
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• EFUG: Back in Holland (EFUG2008)
  H. Roberts, B. Otterloo, NXP Semiconductors, Nijmegen, The Netherlands
  
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• Ion beam interactions during FIBbing (EFUG2009)
  Hugo Bender, IMEC, Belgium
  
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• FIB applications in the nano-technology world (EFUG2013)
  Hugo Bender, IMEC, Leuven, Belgium

FIB process and Instrumentation

• Mass separated Focused Ion Beams using alloy Liquid Metal Ion Sources (EFUG2000)
  L. Bischoff, Ch. Akhmadaliev and J. Teichert, Research Centre Rossendorf Inc., Dresden, Germany
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• Gallium Artefacts on FIB-milled Silicon Samples (EFUG2004)
  Joachim C. Reiner, Philipp Nellen, Urs Sennhauser, EMPA, Dübendorf, Switzerland
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• Low Energy Ion Beam Preparation: Applications and Ga-Contamination (EFUG2007)
  Lutz Hillmann, Uwe Mühle, Jens Steinhoff, Qimonda, Dresden, Germany
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• Realistic 3-D semiconductor models used during cross section, TEM sample preparation, and circuit edit design (EFUG2006)
  M. Weschler, J. Van Kuijk, Coventor, Inc., Cary, USA
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• Innovative CrossBeam Applications in Semiconductor Industry (EFUG2007)
  Heiko Stegmann, Carl Zeiss NTS GmbH, Dresden, Germany
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• FIB Milling Applications for the New HyperionTM Ion Source (EFUG2008)
  N. Smith, P. Tesch, N. Martin, Oregon Physics LLC, Hillsboro, Oregon, USA ; K. Filter, Semion, Hillsboro, Oregon, USA ; R. Boswell, Australian National University, Canberra, Australia
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• Lithography and deposition with a sub-nanometer focused helium beam, Part 2, Part 3 (EFUG2009)
  Paul Alkemade, Vadim Sidorkin, Emile van Veldhoven, Ping Chen, Emile van der Drift, Huub Salemink, Diederik Maas, TU Delft, The Netherlands
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• Methods for Quantifying “Milling Acuity” (EFUG2009)
  Chad Rue, FEI
  
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• Mass filter FIB and Gallium free applications (EFUG2009)
  B. Rasser, A. Delobbe,  Orsay Physics, Fuveau, France
  
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• Non-Gallium Applications for Circuit Edit and Failure Analysis (EFUG2010)
  Chad Rue, FEI, Hilsboro, US
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• SemGlu - A vacuum adhesive for nanoassembly and materials characterisation in FIB systems (EFUG2010)
  Andrew Smith, Andreas Rummel, Stephan Kleindiek, Kleindiek Nanotechnik, Germany
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• Image Processing, Quantification and Model Reconstruction in SEM/FIB - case studies (EFUG2010)
  Daniel Lichau, Visualization Science Group, Bordeaux, France
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• Direct determination of forward sputtering rates and redeposition for Focused Ion Beam milling (EFUG2010)
  Markus Schinnerl, Bernhard Basnar, Alois Lugstein, Emmerich Bertagnolli, Vienna University of Technology, Austria
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• Ion Beam Lithography next generation nanofabrication (EFUG2011)
  Lloyd Peto, Raith GmbH, Dortmund, Germany
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• i-FIB, The ECR-FIB/SEM (EFUG2011)
  Anne Delobbe, Olivier Salord, Pierre Sudraud, Orsay Physics, France
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• Material property characterization and modelling from FIB/SEM nanoscale 3D imaging (EFUG2011)
  Daniel Lichau, V S G - Visualization Sciences Group, Bordeaux, France
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• Reaching all angles - a new five-axis piezo substage (EFUG2011)
  Andrew J. Smith, Andreas Rummel, Klaus Schock Stephan Kleindiek, Kleindiek Nanotechnik, Germany
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• FIB contribution for technological analysis : FIB channelling ion contrast and FIB-EBIC (EFUG2011)
  Hélène Chauvin, Gérald Guibaud, THALES ; Moreno Floris, Guy Perez, Florie Mialhe, Philippe Perdu, CNES, Toulouse, France
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• Give your microscope a hand, Recent advances in handling & chracterizing materials and electronics from micro to nano scale (EFUG2012)
  A. Smith, A. Rummel, K. Schockand, S. Kleindiek, Kleindiek Nanotechnik, Germany
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• Helium Ion Microscopy (EFUG2012)
  P. Gnauck, Carl-Zeiss, Oberkoche, Germany
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• 3D EBIC Tomography by FIB (EFUG2012)
  S. Podda1, E. Musu1, M.Vanzi2, 1 Sardegna Ricerche – Lac. Piscinamanna Ed3. Pula (CA) ; 2 Università degli studi di Cagliari – Piazza D’Armi – Cagliari - Italy
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• 3D FIB-SEM image segmentation and advanced characterization (EFUG2012)
  D. Lichau, VSG, Bordeaux, France
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• Universal pattern generating system for fib applications (EFUG2013)
  Alexey S. Kolomiytsev, Oleg A. Ageev, Vladimir A. Smirnov, Southern Federal University, Russia
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• Efficient Sample Prep Workflow with a New Cleaving Methodology (EFUG2015)
  Efrat Moyal, LatticeGear
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• Surface redeposition and damage due to Focused ion beam milling (EFUG2015)
  H. Bender, A. Franquet, C. Drijbooms, B. Parmentier, W. Vandervorst, L. Kwakman*, Imec, Leuven, Belgium, *FEI Company, Eindhoven, The Netherlands
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• Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model (EFUG2016)
  Jin Huang, TU Dresden
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• Laser based sample preparation for advanced packaging applications (EFUG2016)
  Thomas Höche, Fraunhofer IMWS
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• Pico-second laser and broad argon beam tools for characterization of advanced packages and devices (EFUG2017)
  Vincent Richard, M. Hassel Shearer, Gatan, France
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• ColdFIB - a FIB column with a laser cooled source (EFUG2017)
  Morgan Reveillard, Matthieu Viteau, Anne Delobbe, Arnaud Houel, Daniel Comparat, Orsay Physics, France

FIB gas assisted processing

• Advanced Gas Delivery Approach for Focused Particle Beam System (EFUG2004)
  Valery Ray, Particle Beam Systems &Technology, Methuen, Massachusetts, USA
  
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• Recipe Development Considerations for Focused Ion Beam Gas Assisted Etching (FIB GAE) (EFUG2004)
  Valery Ray, Particle Beam Systems &Technology, Methuen, USA
  
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• Performing E-Beam Induced Gas Assisted Etching with a Dual-Beam FIB (EFUG2001)
  J. Gstöttner, Ch. Stepper, D. Schmitt-Landsiedel, TU München, Germany
  
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• Evolution of Tungsten Film Deposition Induced by Focused Ion Beam (EFUG2002)
  H. Langfischer, B. Basnar and E. Bertagnolli, Institute for Solid State Electronics, Vienna University of Technology, Vienna, Austria
  
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• Ion- and Electron Beam Induced Deposits of Pt, W, and Co: Composition, Volume per Dose and Electrical Transport Properties (EFUG2007)
  A. Fernández-Pacheco, R. Córdoba, J. M. De Teresa, M.R. Ibarra, O. Montero, Universidad de Zaragoza, Spain
  
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• Electrical characterization of FIB-deposited (EFUG2006)
  B. Volbert, Namitec, Eindhoven
  
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• Is E-beam Pt a good protective layer ? (EFUG2005)
  Hugo Bender, IMEC, Belgium
  
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• Artefacts during e-beam deposition of Pt and W (EFUG2007)
  Hugo Bender, IMEC, Belgium
  
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• Measurement of FIB SiO2 deposition by optical beam induced current (EFUG2003)
  Alex Krechmer, Neil Bassom, FEI Company, Peabody, USA
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• Customization of Water-Vapour-Assisted FIB Milling on Diamond Technology (EFUG2008)
  S. Magni, A.S. Campbell, E. Gregoryanz, School of Physics and Astronomy, Edinburgh, Great Britain
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• Higher Resistivity Dielectric (EFUG2008)
  V.V. Makarov, T. Malik, R. Jain, T. Lundquist, DCG Systems, USA
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• Novel Dielectric Etch Solution for FIB Circuit Edit: Application for Editing Memory Devices with Tungsten Metallization (EUG2009)
  Vladimir V. Makarov, Tiza Lab, LLC, Milpitas, CA , USA
  
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• “Free of Charge” FIB Circuit Edit of ICs on 40nm Node (EFUG2012)
  Valery Ray, PBS&T, MEO Engineering Co., Inc. USA

Circuit editing

• FIB process optimisation for complex integrated circuits modification (EFUG2000)
  E. Auvray, SERMA Technologies, Saint Egrève, France
  
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• Through Silicon Editing (EFUG2002)
  Ted Lundquist, Mark Thompson, Erwan Le Roy and Bill Thompson, NPTest Probe Systems
  
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• New Processes for FIB backside Approach (EFUG2003)
  Christian Boit, Berlin University of Technology, Germany, Kristin R. Wirth, ESA, Noordwijk, Netherlands and Erwan LeRoy, NPTest, San Jose CA, USA
  
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• Backside Circuit Edit on Device Level - New Methodologies of Contacting Circuit Nodes for recent and future Circuit Edit (EFUG2006)
  R. Schlangen, U. Kerst, C. Boit, R. Jain, T. Malik, T. Lundquist, TU-Berlin, HLB, and Credence
  
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• Etching the Copper and not the Dielectric (EFUG2003)
  T. Lundquist, J-P Roux and VV Makarov, NPTest Inc., San Jose, USA
  
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• Circuit Edit : Imaging and Endpoint beyond 130 nm (EFUG2002)
  V. Ray, FEI, Peabody, USA
  
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• FIB Materials and Processes for High Aspect Ratio Circuit Edit (EFUG2003)
  Valery Ray, Nicholas Antoniou, Neil Bassom, Huynh Chuong, Tom Gannon, FEI Company, Peabody, USA
  
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• Stage Current Monitoring and Endpointing of Via Milling and Deposition Processes in FIB Circuit Modification (EFUG2003)
  Valery Ray, Nicolas Antoniou, FEI Company, Peabody, USA
  
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• Advanced Image Processing for Improved Visualization and Endpoint Detection (EFUG2007)
  T. Lundquist, D. Renard, R. Jain, M. Phaneuf and K. Lagarec, Credence Systems and Fibics
  
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• Processing of Secondary Electron Endpoint Information (EFUG2006)
  Valery Ray, Particle Beam Systems, Methuen, USA
  
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• Milling High Aspect Ratio (HAR) Holes in Dielectrics (EFUG2005)
  VV Makarov, RK Jain and Ted Lundquist, Credence Systems Corp., Milpitas CA
  
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• High-Throughput Via Milling with Concentrated Gas Delivery (EFUG2005)
  Valery Ray, Particle Beam Systems and Technology, Methuen, MA, USA
  
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• Removing Aluminum Cap in 90 nm Copper Technology (EFUG2006)
  M. Nobile and D. Renard, ST Agrate, Credence DCG
  
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• Repeatability for probing first metal layers from top surface - CMOS65nm technology (EFUG2007)
  Didier Renard Ted Lundquist, Jean-Philippe Roux,Flore Persin and Sylvain Crelerot, Credence Systems Corporation, USA, and ST microelectronics
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• Improvements to support navigation and access in the field of FIB device modification (EFUG2006)
  Siegfried Pauthner, Infineon Technologies AG, Munich, Germany
  
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• Issues to Address for Improved Circuit Edit Productivity (EFUG2007)
  Ted Lundquist, Credence Systems Corporation, USA
  
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• Using SEMulator3D Software for Circuit Edit Work Planning (EFUG2007)
  Chris Kennedy, Coventor, Cary, NC, USA
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• Backside Circuit Edit on Full-Thickness Silicon Devices (EFUG2008)
  C. Rue, FEI Company, Hillsboro, Oregon, USA ; S. Herschbein, C. Scrudato, IBM Corporation, East Fishkill, NY, USA
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• Circuit edit through copper power plane with halogen (EFUG2010)
  Lorenzo Motta, STMicroelectronics, Italy
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• Circuit edit through copper power plane with halogen (EFUG2010)
  L. Motta, D DiDonato, STMicroelectronics, Italy and Sector Technologies, France
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• Full Thickness Silicon Circuit Edits Simplified using Real Time in- situ Optics (EFUG2011)
  M. Antolik, R. Cumming, H. Tanaka, R. Jain, DCG Systems ; Donato DiDonato, Sector Technologies
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• Improving the efficiency of circuit edit (EFUG2011)
  David Donnet, Kimball Skinner, Surendra Madala, Chad Rue and Pete Carleson, FEI Company
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• Package level editing with plasma FIB technology (EFUG2012)
  D. Donnet, FEI, Eindhoven, The Netherlands
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• Localised FIB Deprocessing on Advanced Process Technologies (EFUG2013)
  David Donnet, Oleg Sidorov, Pete Carleson, Chad Rue and Surendra Madala, FEI Company 5350 NE Dawson Creek Drive, Hillsboro, USA
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• Presentation Extending Dualbeam Applications with the Helios PFIB (EFUG2014)
  David Donnet, FEI
  
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• Gas Assisted Plasma FIB Delayering of Advanced Semiconductor Devices (EFUG2015)
  David Donnet, T. Landin, O. Sidorov, C. Rue, R. Alvis, FEI Company, Hillsboro, USA

Failure analysis

• IC Passive Component Modification Using FIB (EFUG2001)
  B. Domenges, B. Feron, J.-P. Gaslonde, H. Murray, Philips Semiconductors, Caen, France
  
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• FIB Assisted Localisation and Preparation of Gate Oxide Fails (EFUG2002)
  R. Rosenkranz, Infineon Technologies Dresden, Germany
  
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• Fast images of FIB x-sections using a CFESEM with BSE-TTL-detection (EFUG2004)
  Klaus Reischle, Klaus Burger, ATMEL, Germany
  
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• FIB Voltage Contrast for Failure Localisation on CMOS Circuits (EFUG2004)
  Ruediger Rosenkranz, Infineon Technologies Dresden, Germany
  
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• Application of FIB in Physical Failure Analysis (EFUG2005)
  Ruediger Rosenkranz, Infineon Technologies Dresden, Germany
  
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• New FA Opportunities with Ultra Thin Silicon (EFUG2007)
  R. Schlangen, U Kerst, C. Boit, S. Schömann, B. Krüger, R. Jain, T. Malik, T. Lundquist, Berlin University of Technology, Infineon Technologies, Munich, Germany and Credence DCG, Sunnyvale, USA
  
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• Structural analysis of through silicon vias (TSV) (EFUG2010)
  Hugo Bender, Chris Drijbooms, Patricia Van Marcke, Jef Geypen, Olivier Richard, Paola Favia, IMEC, Belgium
  
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• FIB for optoelectronics failure analysis (EFUG2010)
  Gérald Guibaud, Hélène Chauvin, Vanessa Chazal, Guy Perez, Kevin Sanchez, Philippe Perdu, Thales and CNES, France
  
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• Preparation on 3D interconnects - FA work flow for shorted Cu/Sn-Cu Bondings (EFUG2011)
  Jens Beyersdorfer, Frank Altmann,Christian Große, Susanne Hübner, Michél Simon-Najasek, Andreas Graff,Diagnostic of Semiconductor Technologies, Fraunhofer Institute for Mechanics of Materials, Halle, Germany
  
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• Site-specific Physical Failure Analysis of 3D Systems using “Plasma” FIB (EFUG2011)
  Remco Geurts, P.D. Carleson, R.J. Young, R. Routh, C. Rue, G. Franz and L.F.Tz. Kwakman,FEI Company
  
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• FIB Memory Invasive Fault Injection for software qualification (EFUG2011)
  Maria Mazurek, Simon Brule, Thomas Zirilli, Freescale Semiconductor Toulouse ; Hélène Chauvin, Vanessa Chazal, Fabien Battistella, Philippe Perdu, THALES / CNES ; Didier Renard, Sector Technologies
  
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• FIB/SEM structural analysis of Through-Silicon-Vias (TSV) (EFUG2011)
  Hugo Bender, Chris Drijbooms, Alex Radisic, imec, Leuven, Belgium
  
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• Failure Analysis in FIB/SEM - Locating Failures and performing Nanoprobing in situ (EFUG2015)
  Matthias Kemmler, A. Rummel, K. Schock, S, Kleindiek, Kleindiek Nanotechnik, Reutlingen, Germany
  
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• FIB device surgery for noise reduction in InGaAs/InP SPAD Arrays (EFUG2015)
  Lorenzo Motta, C. Savoia, N. Calandri, M. Sanzaro, A. Tosi, STMicroelectronics, Agrate Brianza, Italy
  
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• In-situ delayering and nanoprobing for streamlined failure analysis (EFUG2017)
  Andrew J. Smith, Andreas Rummerl, Klaus Schock, Matthias Kemmler, Kleindiek Nanotechnik, Germany ; Tomas Hrncir, Gregory Goupil, Sharang, Marek Sikula, Stephan Kleindiek, Tescan Orsay Holding, Brno
  
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• Combination of precise laser and FIB milling for TEM based IC failure analysis (EFUG2017)
  Frank Altmann, Michel Simon-Najasek, Susanne Hübner, Mickael Lejoueux, Fraunhofer Institute for Microstructure of Materials and Systems, Halle, Germany

TEM sample preparation

• TEM specimen preparation by focused ion beam sputtering – optimisation of the process (EFUG2000)
  B. Köhler, G. Irmer, L. Bischoff and J. Teichert, Fraunhofer IZFP/EADQ Dresden, Technische Universität Bergakademie Freiberg, Forschungszentrum Rossendorf, Dresden
  
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• FIB-TEM Sample Preparation by In-Situ Lift Out Technique (EFUG2001)
  H. Roberts and B. Otterloo, Philips Semiconductors, Nijmegen, The Netherlands
  
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• In-situ Lift-Out of TEM-Lamellae using a Compact and Precise Micromanipulator (EFUG2002)
  Claus Burkhardt, Stephan Kleindiek, Peter Gnauck, Johannes Bihr, Wilfried Nisch, Naturwissenschafliches und Medizinisches Institut, Reutlingen, Germany, Kleindiek Nanotechnik GmBH, Reutlingen, Germany and LEO Elektronenmikroskopie GmbH, Oberkochen, Germany
  
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• Examples of FIB-TEM sample preparation by in-situ lift out technique (EFUG2002)
  Harry Roberts, David Donnet, Bert Otterloo and Ann De Veirman, Philips Semiconductors, Nijmegen, The Netherlands
  
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• Novel FIB-based sample Preparation Technique for TEM Analysis of Ultra-Thin Gate Oxide Breakdown (EFUG2002)
  J. Reiner, Ph. Gasser, U. Sennhauser, EMPA, Dübendorf, Switzerland
  
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• In-situ plucker system for preparation of TEM samples by FIB: new applications, future prospects and challenges (EFUG2003)
  A. Benedetti, H. Bender, IMEC, Leuven, Belgium.
  
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• Dual Beam FIB/SEM-STEM : the missing link between SEM and TEM (EFUG2004)
  Hélène Jousset and Paul-Henri Albarede, Altis Semiconductor, Corbeil-Essonnes, France
  
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• Triple Beam for TEM sample preparation (EFUG2005)
  Toshiaki Fujii, Haruo Takahashi, SII NanoTechnology Inc., Japan
  
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• Use of the ASCEND Xtreme Access manipulator for TEM specimen lift out (EFUG2006)
  C. Große, M. Simon, F. Altmann, Fraunhofer Institute for Mechanics of Materials, Halle
  
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• Mechanical Conversion for High Through-Put TEM Sample Preparation (EFUG2006)
  T. Kendrick, T. Moore, L. Zaykova-Feldman SEM-FIB Solutions
  
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• FIB induced damages of SEM/TEM samples of semiconductor devices (EFUG2000)
  E. Langer, H.-J. Engelmann, B. Volkmann and E. Zschech, AMD Saxony Manufacturing GmbH, Dresden, Germany
  
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• Some observations on the corrosion of Cu after FIB preparation (EFUG2004)
  Hugo Bender, O. Richard, A. Benedetti, P. Van Marcke, C. Drijbooms, IMEC, Leuven, Belgium
  
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• A methodology to reduce artefacts during TEM sample preparation using FIB (EFUG2006)
  A. Collantes, Failure Analysis Infineon Technologies AG, Munich, Germany
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• FIB applications off the beaten path: TEM plan-view sample preparation using circuit-edit tools (EFUG2008)
  F. Voogt, NXP Semiconductors Nijmegen, The Netherlands
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• On the gallium accumulation at the boundaries of Al layers in FIB prepared TEM specimens (EFUG2008)
  H. Bender, IMEC, Belgium
  
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• Method for improving FIB prepared TEM samples by very low energy Ar+ ion mill polishing (EFUG2010)
  Yaron Kauffmann, Tzipi Cohen-Hyams, Michael Kalina, Hila Sadan-Metlzman and Wayne D. Kaplan, Tecnion, Haifa, Israel
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• FIB target preparation for 20 kV (S)TEM - A new method for obtaining ultra-thin lamellas (EFUG2010)
  Lorenz Lechner, J. Biskupek, U. Kaiser, Ulm University, Germany
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• Advanced FIB sample preparation for high performance TEM analysis (EFUG2011)
  Michél Simon-Najasek, Susanne Hübner, Frank Altmann, Christian Große, Roland Salzer, Andreas Graff, Diagnostic of Semiconductor Technologies, Fraunhofer Institute for Mechanics of Materials, Halle, Germany.
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• FIB/TEM analysis of Si/Ge/Sn alloys:results, problems and perspectives (EFUG2012)
  A. Benedetti, *S. Stefanov, *J. Serra, * P. Gonzàlez,*S. Chiussi, CACTI, University of Vigo ; *New Materials Group, University of Vigo, Spain
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• Problems and solutions  when using FIB to prep nanostructures for TEM (EFUG2015)
  Filip Lenrick, Lund University
  
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• Plan-view specimen preparation of device structures with FIB (EFUG2015)
  P. Van Marcke, H. Bender, O. Richard, P. Favia, Imec, Leuven, Belgium
  
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• Fast, Reliable, Intuitive TEM Sample Preparation using a Load-Lockable Platform Combined with Smart Control Software (EFUG2016)
  Stephan Kleindiek, Kleindiek Nanotechnik GmbH
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• FIB automation for TEM prep and tool maintenance (EFUG2017)
  Valerie Brogden, ThermoFisher Scientific, The Netherlands

Materials analysis

• Spatial and Special FIB application: The debris issue (EFUG2000)
  Ch. Durin and Ph. Perdu, CNES, Toulouse, France
  
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• Chemical analysis on Focused Ion Beam cross-sections by scanning Auger microscopy (EFUG2001)
  H. Bender, IMEC, Leuven, Belgium
  
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• Orientation Imaging Microscopy Applications in Cu-Interconnects and Cu-Cu Wire Bonding (EFUG2002)
  P. Ratchev, L. Carbonell, H.M. Ho, H. Bender, I. De Wolf, B. Verlinden, IMEC, Leuven, Belgium
  
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• Looking below the surface using Ion Beam and DualBeam Techniques (EFUG2002)
  Dirk van der Wal, H. Mulders, FEI, Eindhoven, The Netherlands
  
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• Multi Layer and Micro Graded Stress Analysis (EFUG2007)
  Richard Langford, Xiaofeng Zhou, Christopher Gill, Joe Keller, Toby Ayers, Philip Withers, Materials Science Centre, Manchester University, UK
  
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• FIB slicing and imaging of palaeopalynological remains: a 3D inside look into the past (EFUG2010)
  A.Benedetti, J. Mendez, J. B. Diez, U. Villanueva-Amadoz, L. M. Sender, Universidad de Vijo, Spain
  
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• SEM/FIB with TOF-SIMS: Introduction and Application Examples (EFUG2012)
  James Whitby, Deborah Alberts and Johann Michler Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructure, Switzerland
  
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• Measurement of residual stress by focused ion beam milling (EFUG2013)
  Marco Sebastiani, Department of Engineering University "Roma Tre", Rome, Italy

Micro and nanostructuring

• Application of a Focused Ion Beam System to the Micromachining of 3-D Shapes (EFUG2000)
  R. M. Langford, A. K. Petford-Long and S. Egelkamp, Department of Materials, University of Oxford, Oxford, UK, Soft Imaging Systems, Münster, Germany
  
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• FIB Based Micro Fabrication Technique for a Novel Type of Scanning Electrochemical Microscopy Probes (EFUG2000)
  A. Lugstein, Vienna University of Technology, Vienna, Austria
  
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• FIB modification of AFM tips for electrochemical applications (EFUG2003)
  G.C. Gazzadi, C. Menozzi, P. Facci and S. Frabboni, INFM National Research Center on nanoStructures and bioSystems at Surfaces (S3), Modena, Italy
  
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• CoSi2 nano – wires synthesized by FIB processing (EFUG2004)
  L. Bischoff, B. Schmidt, C. Akhmadaliev, and L. Röntzsch, Forschungszentrum Rossendorf, Dresden, Germany
  
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• Exotic application of FIB : magneto-resistive sensor modification (EFUG2002)
  B. Domenges, O. Crepel, C. Goupil, Philips Semiconductors, Caen, France
  
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• Focused Ion Beam Microstructuring (EFUG2004)
  Rolf Brönniman, Philipp M. Nellen, Joachim C. Reiner, Stephan Meier, Pascal Jud, Andreas Beu, EMPA, Dübendorf, Switzerland
  
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• Dual Beam approach to fabrication of sub-20nm gap nanoelectrodes (EFUG2004)
  Gian Carlo Gazzadi and S. Frabboni, Università di Modena, Modena, Italy
  
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• Morphological study of submicron elements FIB-patterned on ferromagnetic-antiferromagnetic Fe/NiO layers (EFUG2004)
  G.C. Gazzadi, P. Luches, S. F. Contri, A. di Bona, S. Valeri, INMF and Università di Modena, Modena, Italy
  
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• FIB Milling of Photonic Nanostructures (EFUG2007)
  Tim Thomay, University of Konstanz, Germany
  
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• Combination of FIB and Conventional Processes in Microelectronics (EFUG2009)
  Tzipi Cohen-Hyam s, Elad Peer, Uri Sivan and Wayne D. Kaplan, Technion, Haifa, Israel
  
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• FIB processing of the NiTiCu shape memory alloy and Nanotweezers controllable operation in the environment of FIB device (EFUG2009)
  A.Irzhak, V.Koledov, V. Shavrov, S. von Gratowski, D.Zakharov, Academy of Sciences, Moscow, Russia
  
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• FIB production of shape memory alloy nano-gripper for FIB-application (EFUG2010)
  V.V. Koledov, A.Irzhak, S.V. von Gratowski, V.G. Shavrov, D.Zakharov, Academy of Sciences, Moscow, Russia
  
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• Focused Ion Beam electrode patterning for nanostructured material-based chemical gas sensor (EFUG2010)
  Vera La Ferrara, B. Alfano, G. Fiorentino, M. Miglietta, E. Massera, T. Polichetti, G.Di Francia, ENEA, Italy
  
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• Nanoimprinted metallic probe demonstrators for electrical scanning probe microscopy: Manufacturing, characterization and application (EFUG2010)
  Joachim Jambreck, V. Yanev, H. Schmitt, M. Rommel, A. J. Bauer, L. Frey, Fraunhofer, Germany
  
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• Fabrication of Nano Scale Single Crystalline Diamond Tools by Focused Ion Beam (EFUG2011)
  Jining Sun, Xichun Luo, James Ritchie, and Wenlong Chang,Heriot–Watt University, Edinburgh, UK
  
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• Deterministic fabrication of reflective mirror on an optical fibre (EFUG2012)
  Jining Sun, Heriot-Watt University, Edinburgh, UK
  
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• SPM probe modification using Focused Ion Beam (EFUG2013)
  Alexey S. Kolomiytsev, Oleg A. Ageev, Vladimir A. Smirnov, Southern Federal University, Russia

Bio and soft materials

• FIB in Life Sciences (EFUG2002)
  Monica Ballerini, Marziale Milani, Università degli Studi di Milano-Bicocca,Milano, Italy
  
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• FIBs and Soft materials (EFUG2007)
  Marziale Milani, University Milano, Milano, Italy
  .
• New FIB Processing Concept for Nanocarbons (EFUG2008)
  L.G. Lechner, Low Temperature Laboratory, Helsinki University, Finland
  .
• Preparation of high quality nanopores for successful nanobiology experiments (EFUG2009)
  E. Bourhis, J. Gierak, A. Oukhaled, A. Madouri, G. Patriarche, B. Schiedt, L. Auvray, LPN/CNRS, Marcoussis, France
  .
• Designing platinum features to mimic protein channels (EFUG2011)
  Stefano Pagliara, Catalin Chimerel, Richard Langford, Dirk G.A. L. Aarts, Ulrich F. Keyser Cavendish Laboratory, University of Cambridge and Department of Chemistry, University of Oxford, UK
  .
• FIB Micro/Nano fabrication of silicon master for biomedical applications (EFUG2012)
  G. Firpo, L. Repetto, E. Angeli, P. Fanzio, P.Guida, V. Ierardi, C. Manneschi, V. Mussi, U. Valbusa Nanomed lab, Dipartimento di Fisica - Università degli Studi di Genova, Italy
  .
• In situ Mechanical Measurements to Access the Effects of Bioglass on Dentin and Enamel Surfaces. (EFUG2012)
  M. Payne, University Cambridge, UK