10th European FIB Users Group Meeting (EFUG2006)
Programme and presentations
Monday 2 October 2006, Wuppertal, Germany
Oral presentations
Sample Preparation and Material Analysis
-
Where to go: FIB and target preparation
C. Holzapfel, Funktionswerkstoffe, Institut für Werkstoffwissenschaft, Universität des Saarlandes.
-
Characterization of a Ga-Bi Liquid Metal Alloy Ion Source
Sh. Akhmadaliev, W. Pilz, L. Bischoff and Th. Ganetsos,
Research Center Rossendorf, Institute of Ion Beam Physics and Materials Research Dresden Germany.
-
HOPG surface functionalisation using newly developed FIB nanowriter
L. Bruchhaus, Raith GmhH, Dortmund, Germany.
-
Realistic 3-D semiconductor models used during cross section, TEM
sample preparation, and circuit edit design
M. Weschler, J. Van Kuijk, Coventor, Inc., Cary, NC USA
Presentation (2271kB, Acrobat format).
-
A new method for handling TEM specimens in a FIB system
A. Rummel, S. Kleindiek and B.W.M. Volbert,
Kleindiek Nanotechnik.
-
A methodology to reduce artefacts during TEM sample preparation using FIB
A. Collantes, Failure Analysis Infineon Technologies AG, Munich
Presentation (1776kB, Acrobat format).
-
Control of TEM sample thickness during FIB preparation by e-beam observation
A. Graff, M. Simon, F. Altmann,
Fraunhofer IWMH, Heideallee, Halle, Germany.
-
Sample Preparation for Advanced Microscopy
A. Harrison, Department of Materials Science, University of Cambridge.
Micromachining, circuit editing and Other Analysis Techniques
-
Introducing the German three-countries FIB user group
M. Rogers, Institute for Electron Microscopy, Graz University of Technology.
-
Progress in Atom Probe specimen fabrication methods using a dual beam FIB
P. Clifton, Oxford nanoScience Ltd, Imago Scientific Instruments Corporation.
-
Mixed Field Milling for Advanced Front-Side Circuit Edit
C. Rue, FEI Company Hillsboro, OR.
-
FIB imaging and cross-sectioning of soft materials
A. Penkova and R. M. Langford*, Institue of Physical Chemistry, Bulgaria Academy of Science,
*University of Manchester.
-
Mechanical Conversion for High Through-Put TEM Sample Preparation
T. Kendrick, T. Moore, L. Zaykova-Feldman SEM-FIB Solutions.
Presentation (1408kB, Acrobat format).
Devices
-
Advanced Image Processing for Improved Visualization and Endpoint Detection
T. Lundquist, D. Renard, R. Jain, M. Phaneuf* and K. Lagarec*, Credence Systems, *Fibics.
Presentation (1472kB, Acrobat format).
-
Backside Circuit Edit on Device Level - New Methodologies of Contacting Circuit Nodes for recent and future Circuit Edit
R. Schlangen, U. Kerst, C. Boit, R. Jain*, T. Malik*, T. Lundquist*, TU-Berlin, HLB, *Credence
Presentation (2438kB, Acrobat format).
-
3D (360degree) failure characterization in semiconductor devices using Hitachi's FIB/STEM system FB-2100/HD-2300
R. Schmidt, Hitachi High Technologies Europe GmbH Krefeld.
-
Non-planarized Passivated Aluminium Dummy Fill Removal
M. Nobile and D. Renard, ST Agrate, Credence DCG
Presentation (2550kB, Acrobat format).
Posters
- High Throughput Via Milling by FIB with Concentrated Gas.
Valery Ray, Particle Beam Systems & Technology, Methuen, Massachusetts, USA
- Use of the ASCEND Xtreme Access manipulator for TEM specimen lift out
C. Große, M. Simon, F. Altmann, Fraunhofer Institute for Mechanics of Materials, Halle
Poster (1061kB, Acrobat format).
- A closer look at the pyrolysis of MOD-TFA YBCO thin
T. Thersleff, Leibniz Institute for Solid State and Materials Research Dresden
- Preparation of TEM samples from coated alloy systems using FIB
G. West, IPTME, Loughborough University, UK
- FIB applications in TEM sample preparation and nanostructuring
Schwedt, Gemeinschaftslabor fuer Elektronenmikroskopie, RWTH Aachen
- Ionshaper - New software for sputter simulation
E. Platzgummer, IMS, Wein
- Electrical characterization of FIB-deposited
B. Volbert, Namitec, Eindhoven
Poster (1669kB, Acrobat format)
- Preparation of Nanotubes inside a CossBeam FIB
S. Menzel, IFW, Dresden
- FIB for particle morphology investigation
S. Belochapkine, Materials & Surface Science Institute, University of Limerick
- Micromachining of photonic devices in silicon-on-insulator
J. Schrauwen, IMEC, U. Gent, Belgium.
- Metal island growth on nanostructured graphite
Farhad Ghaleh, Universität Dortmund Experimentelle Physik
- Processing of Secondary Electron Endpoint Information
Valery Ray, Particle Beam Systems, Methuen
Poster (509kB, Acrobat format)
- Improvements to support navigation and access in
the field of FIB device modification
Siegfried Pauthner, Infineon Technologies AG, Business Group Communication Solutions
Poster (152kB, Acrobat format)
- The use of a Dualbeam for cross section imaging of nanofiltration membranes
J . De Baerdemaeker , K. Boussu2, B. Van der Bruggen2, C. Dauwe1 ,
1 Department of Subatomic and Radiation Physics, Ghent University, Ghent, Belgium,
2 Laboratory for Applied Physical Chemistry and Environmental Technology, Department of Chemical Engineering, K.U.Leuven, Leuven, Belgium
- Secondary Ion Mass Spectroscopy (SIMS) in a CrossBeam FIB-SEM Microscope
Claus Burkhardt, Erfahrensentwicklung, Technische Physik NMI Naturwissenschaftliches und Medizinisches Institut, Reutlingen
- Focused Ion Beam Sputtering and Gas Assisted Etching of Quartz (0001)
Andreas Steiger-Thirsfeld,
Vienna University of Technology, Institut for Solid State Electronics, Vienna
- Plan individuation and cross preparation with dual beam
Emanuela RICCI, STMicroelectronic, Via Olivetti, Agrate Brianza, MI, Italy
- FIB-modified probes for innovative SPM applications
Claudia Menozzi,
CNR-INFM-S3, Physics Dept., Modena Italy
- Mn containing alloy LMIS for Spintronics
Sh. Akhmadaliev, W. Pilz, L. Bischoff and Th. Ganetsos,
Research Center Rossendorf, Institute of Ion Beam Physics and Materials Research Dresden Germany
Sponsoring
The EFUG2006 meeting was kindly sponsored by : Carl-Zeiss, Credence, FEI and Raith.
![home](EFUG_home.gif)
Contact : European FIB Users Group