10th European FIB Users Group Meeting (EFUG2006)
Programme and presentations
Monday 2 October 2006, Wuppertal, Germany

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Oral presentations

• Where to go: FIB and target preparation
  C. Holzapfel, Funktionswerkstoffe, Institut für Werkstoffwissenschaft, Universität des Saarlandes.

• Characterization of a Ga-Bi Liquid Metal Alloy Ion Source
  Sh. Akhmadaliev, W. Pilz, L. Bischoff and Th. Ganetsos, Research Center Rossendorf, Institute of Ion Beam Physics and Materials Research Dresden Germany.

• HOPG surface functionalisation using newly developed FIB nanowriter
  L. Bruchhaus, Raith GmhH, Dortmund, Germany.

• Realistic 3-D semiconductor models used during cross section, TEM sample preparation, and circuit edit design
  M. Weschler, J. Van Kuijk, Coventor, Inc., Cary, NC USA
  Presentation (2271kB, Acrobat format).

• A new method for handling TEM specimens in a FIB system
  A. Rummel, S. Kleindiek and B.W.M. Volbert, Kleindiek Nanotechnik.

• A methodology to reduce artefacts during TEM sample preparation using FIB
  A. Collantes, Failure Analysis Infineon Technologies AG, Munich
  Presentation (1776kB, Acrobat format).

• Control of TEM sample thickness during FIB preparation by e-beam observation
  A. Graff, M. Simon, F. Altmann, Fraunhofer IWMH, Heideallee, Halle, Germany.

• Sample Preparation for Advanced Microscopy
  A. Harrison, Department of Materials Science, University of Cambridge.

• Introducing the German three-countries FIB user group
  M. Rogers, Institute for Electron Microscopy, Graz University of Technology.

• Progress in Atom Probe specimen fabrication methods using a dual beam FIB
  P. Clifton, Oxford nanoScience Ltd, Imago Scientific Instruments Corporation.

• Mixed Field Milling for Advanced Front-Side Circuit Edit
  C. Rue, FEI Company Hillsboro, OR.

• FIB imaging and cross-sectioning of soft materials
  A. Penkova and R. M. Langford*, Institue of Physical Chemistry, Bulgaria Academy of Science, *University of Manchester.

• Mechanical Conversion for High Through-Put TEM Sample Preparation
  T. Kendrick, T. Moore, L. Zaykova-Feldman SEM-FIB Solutions.
  Presentation (1408kB, Acrobat format).

• Advanced Image Processing for Improved Visualization and Endpoint Detection
  T. Lundquist, D. Renard, R. Jain, M. Phaneuf* and K. Lagarec*, Credence Systems, *Fibics.
  Presentation (1472kB, Acrobat format).

• Backside Circuit Edit on Device Level - New Methodologies of Contacting Circuit Nodes for recent and future Circuit Edit
  R. Schlangen, U. Kerst, C. Boit, R. Jain*, T. Malik*, T. Lundquist*, TU-Berlin, HLB, *Credence
  Presentation (2438kB, Acrobat format).

• 3D (360degree) failure characterization in semiconductor devices using Hitachi's FIB/STEM system FB-2100/HD-2300
  R. Schmidt, Hitachi High Technologies Europe GmbH Krefeld.

• Non-planarized Passivated Aluminium Dummy Fill Removal
  M. Nobile and D. Renard, ST Agrate, Credence DCG
  Presentation (2550kB, Acrobat format).

Posters

• High Throughput Via Milling by FIB with Concentrated Gas.
  Valery Ray, Particle Beam Systems & Technology, Methuen, Massachusetts, USA
• Use of the ASCEND Xtreme Access manipulator for TEM specimen lift out
  C. Große, M. Simon, F. Altmann, Fraunhofer Institute for Mechanics of Materials, Halle
  Poster (1061kB, Acrobat format).
• A closer look at the pyrolysis of MOD-TFA YBCO thin
  T. Thersleff, Leibniz Institute for Solid State and Materials Research Dresden
• Preparation of TEM samples from coated alloy systems using FIB
  G. West, IPTME, Loughborough University, UK
• FIB applications in TEM sample preparation and nanostructuring
  Schwedt, Gemeinschaftslabor fuer Elektronenmikroskopie, RWTH Aachen
• Ionshaper - New software for sputter simulation
  E. Platzgummer, IMS, Wein
• Electrical characterization of FIB-deposited
  B. Volbert, Namitec, Eindhoven
  Poster (1669kB, Acrobat format)
• Preparation of Nanotubes inside a CossBeam FIB
  S. Menzel, IFW, Dresden
• FIB for particle morphology investigation
  S. Belochapkine, Materials & Surface Science Institute, University of Limerick
• Micromachining of photonic devices in silicon-on-insulator
  J. Schrauwen, IMEC, U. Gent, Belgium.
• Metal island growth on nanostructured graphite
  Farhad Ghaleh, Universität Dortmund Experimentelle Physik
• Processing of Secondary Electron Endpoint Information
  Valery Ray, Particle Beam Systems, Methuen
  Poster (509kB, Acrobat format)
• Improvements to support navigation and access in the field of FIB device modification
  Siegfried Pauthner, Infineon Technologies AG, Business Group Communication Solutions
  Poster (152kB, Acrobat format)
• The use of a Dualbeam for cross section imaging of nanofiltration membranes
  J . De Baerdemaeker , K. Boussu2, B. Van der Bruggen2, C. Dauwe1 , 1 Department of Subatomic and Radiation Physics, Ghent University, Ghent, Belgium, 2 Laboratory for Applied Physical Chemistry and Environmental Technology, Department of Chemical Engineering, K.U.Leuven, Leuven, Belgium
• Secondary Ion Mass Spectroscopy (SIMS) in a CrossBeam FIB-SEM Microscope
  Claus Burkhardt, Erfahrensentwicklung, Technische Physik NMI Naturwissenschaftliches und Medizinisches Institut, Reutlingen
• Focused Ion Beam Sputtering and Gas Assisted Etching of Quartz (0001)
  Andreas Steiger-Thirsfeld, Vienna University of Technology, Institut for Solid State Electronics, Vienna
• Plan individuation and cross preparation with dual beam
  Emanuela RICCI, STMicroelectronic, Via Olivetti, Agrate Brianza, MI, Italy
• FIB-modified probes for innovative SPM applications
  Claudia Menozzi, CNR-INFM-S3, Physics Dept., Modena Italy
• Mn containing alloy LMIS for Spintronics
  Sh. Akhmadaliev, W. Pilz, L. Bischoff and Th. Ganetsos, Research Center Rossendorf, Institute of Ion Beam Physics and Materials Research Dresden Germany

Sponsoring