15th European FIB Users Group Meeting (EFUG2011)
Programme and presentations
Monday 3 October 2011, Bordeaux, France.

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Oral presentations

• 15 years of playing with a FIB: Sample preparation and micromachining
  Richard Langford, Cavendish Lab, Cambridge University, UK.

• Advanced FIB sample preparation for high performance TEM analysis
  Michél Simon-Najasek, Susanne Hübner, Frank Altmann, Christian Große, Roland Salzer, Andreas Graff, Diagnostic of Semiconductor Technologies, Fraunhofer Institute for Mechanics of Materials, Halle, Germany.
  Presentation

• Preparation on 3D interconnects - FA work flow for shorted Cu/Sn-Cu Bondings
  Jens Beyersdorfer, Frank Altmann,Christian Große, Susanne Hübner, Michél Simon-Najasek, Andreas Graff,Diagnostic of Semiconductor Technologies, Fraunhofer Institute for Mechanics of Materials, Halle, Germany.
  Presentation

• Fabrication of Nano Scale Single Crystalline Diamond Tools by Focused Ion Beam
  Jining Sun, Xichun Luo, James Ritchie, and Wenlong Chang, Heriot–Watt University, Edinburgh, UK.
  Presentation

• Designing platinum features to mimic protein channels
  Stefano Pagliara, Catalin Chimerel, Richard Langford, Dirk G.A. L. Aarts, Ulrich F. Keyser Cavendish Laboratory, University of Cambridge and Department of Chemistry, University of Oxford, UK.
  Presentation

• Site-specific Physical Failure Analysis of 3D Systems using “Plasma” FIB
  Remco Geurts, P.D. Carleson, R.J. Young, R. Routh, C. Rue, G. Franz and L.F.Tz. Kwakman, FEI Company.
  Presentation

• Ion Beam Lithography next generation nanofabrication
  Lloyd Peto, Raith GmbH, Dortmund, Germany.
  Presentation

• i-FIB, The ECR-FIB/SEM
  Anne Delobbe, Olivier Salord, Pierre Sudraud, Orsay Physics, France.
  Presentation

• Material property characterization and modelling from FIB/SEM nanoscale 3D imaging
  Daniel Lichau, V S G - Visualization Sciences Group, Bordeaux, France.
  Presentation

• 3D EDS and EBSD in the FIB-SEM
  Christian Lang, Oxford Instruments, UK.

• Full Thickness Silicon Circuit Edits Simplified using Real Time in- situ Optics
  M. Antolik, R. Cumming, H. Tanaka, R. Jain, DCG Systems ; Donato DiDonato, Sector Technologies.
  Presentation

• Reaching all angles - a new five-axis piezo substage
  Andrew J. Smith, Andreas Rummel, Klaus Schock Stephan Kleindiek, Kleindiek Nanotechnik, Germany.
  Presentation

• Improving the efficiency of circuit edit
  David Donnet, Kimball Skinner, Surendra Madala, Chad Rue and Pete Carleson, FEI Company.
  Presentation

Posters

• FIB Memory Invasive Fault Injection for software qualification
  Maria Mazurek, Simon Brule, Thomas Zirilli, Freescale Semiconductor Toulouse ; Hélène Chauvin, Vanessa Chazal, Fabien Battistella, Philippe Perdu, THALES / CNES ; Didier Renard, Sector Technologies.
  Poster
• FIB contribution for technological analysis : FIB channelling ion contrast and FIB-EBIC
  Hélène Chauvin, Gérald Guibaud, THALES ; Moreno Floris, Guy Perez, Florie Mialhe, Philippe Perdu, CNES, Toulouse, France.
  Poster
• FIB/SEM structural analysis of Through-Silicon-Vias (TSV)
  Hugo Bender, Chris Drijbooms, Alex Radisic, imec, Leuven, Belgium.
  Poster
  

Sponsoring