14th European FIB Users Group Meeting (EFUG2010)
Programme and presentations
Monday 11 October 2010, Gaeta, Italy.
Oral presentations
- FIB/SEM applications in life sciences
Andreas Schertl, Zeiss, Oberkochen, Germany.
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Non-Gallium Applications for Circuit Edit and Failure Analysis
Chad Rue, FEI, Hilsboro, US.
Presentation
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FIB/ESEM anc cryo-analysis of dentine
Rowan Leary, Nathan Topping, Jon Earle and Richard
Langford, University of Cambridge, UK.
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Method for improving FIB prepared TEM samples by very low energy Ar+ ion mill polishing
Yaron Kauffmann, Tzipi Cohen-Hyams, Michael Kalina, Hila Sadan-Metlzman and Wayne D. Kaplan, Tecnion, Haifa, Israel.
Presentation
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FIB target preparation for 20 kV (S)TEM - A new method for obtaining ultra-thin lamellas
Lorenz Lechner, J. Biskupek, U. Kaiser, Ulm University, Germany.
Presentation
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FIB applications in Grenoble
Geoffroy Auvert, CEA, Grenoble, France.
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SemGlu - A vacuum adhesive for nanoassembly and materials characterisation in FIB systems
Andrew Smith, Andreas Rummel, Stephan Kleindiek, Kleindiek Nanotechnik, Germany.
Presentation
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FIB production of shape memory alloy nano-gripper for FIB-application
V.V. Koledov, A.Irzhak, S.V. von Gratowski, V.G. Shavrov, D.Zakharov, Academy of Sciences, Moscow, Russia.
Presentation
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Circuit edit through copper power plane with halogen
Lorenzo Motta, ST, Italy.
Presentation
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Image Processing, Quantification and Model Reconstruction in SEM/FIB - case studies
Daniel Lichau, Visualization Science Group, Bordeaux, France.
Presentation
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Structural analysis of through silicon vias (TSV)
Hugo Bender, Chris Drijbooms, Patricia Van Marcke, Jef Geypen, Olivier Richard, Paola Favia, IMEC, Belgium.
Presentation
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Focused Ion Beam electrode patterning for nanostructured material-based chemical gas sensor
Vera La Ferrara, B. Alfano, G. Fiorentino, M. Miglietta, E. Massera, T. Polichetti, G.Di Francia, ENEA, Italy.
Presentation
Posters
- Nanoimprinted metallic probe demonstrators for electrical scanning probe microscopy: Manufacturing, characterization, and application
Joachim Jambreck, V. Yanev, H. Schmitt, M. Rommel, A. J. Bauer, L. Frey, Fraunhofer, Germany.
Poster
- FIB slicing and imaging of palaeopalynological remains: a 3D inside look into the past
A.Benedetti, J. Mendez, J. B. Diez, U. Villanueva-Amadoz, L. M. Sender, Universidad de Vijo, Spain.
Poster
- FIB for optoelectronics failure analysis
Gérald Guibaud, Hélène Chauvin, Vanessa Chazal, Guy Perez, Kevin Sanchez, Philippe Perdu, Thales and CNES, France.
Poster
- Direct determination of forward sputtering rates and redeposition for Focused Ion Beam milling
Markus Schinnerl, Bernhard Basnar, Alois Lugstein, Emmerich Bertagnolli, Vienna University of Technology, Austria.
Poster
- Circuit edit through copper power plane with halogen
L. Motta, D DiDonato, STMicroelectronics and Sector Technologies.
Poster
- In-line, non destructive, and direct measurement performed by FIB in semiconductor manufacturing environments
F. Giarrizzo, S. Damigella, G. Mazzaglia and D. Mello, ST Microelectronics, Catania, Italy.
- Mixed technique for TEM sample preparation on device having SiC substrate
G. Anastasi, F. Giarrizzo and Domenico Mello
- Visualization Sciences Group
Daniel Lichau
Sponsoring
The EFUG2010 meeting was kindly sponsored by : Carl-Zeiss, FEI and OrsayPhysics.
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Contact : European FIB Users Group