14th European FIB Users Group Meeting (EFUG2010)
Programme and presentations
Monday 11 October 2010, Gaeta, Italy.

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Oral presentations

• FIB/SEM applications in life sciences
  Andreas Schertl, Zeiss, Oberkochen, Germany.

• Non-Gallium Applications for Circuit Edit and Failure Analysis
  Chad Rue, FEI, Hilsboro, US.
  Presentation

• FIB/ESEM anc cryo-analysis of dentine
  Rowan Leary, Nathan Topping, Jon Earle and Richard Langford, University of Cambridge, UK.

• Method for improving FIB prepared TEM samples by very low energy Ar+ ion mill polishing
  Yaron Kauffmann, Tzipi Cohen-Hyams, Michael Kalina, Hila Sadan-Metlzman and Wayne D. Kaplan, Tecnion, Haifa, Israel.
  Presentation

• FIB target preparation for 20 kV (S)TEM - A new method for obtaining ultra-thin lamellas
  Lorenz Lechner, J. Biskupek, U. Kaiser, Ulm University, Germany.
  Presentation

• FIB applications in Grenoble
  Geoffroy Auvert, CEA, Grenoble, France.

• SemGlu - A vacuum adhesive for nanoassembly and materials characterisation in FIB systems
  Andrew Smith, Andreas Rummel, Stephan Kleindiek, Kleindiek Nanotechnik, Germany.
  Presentation

• FIB production of shape memory alloy nano-gripper for FIB-application
  V.V. Koledov, A.Irzhak, S.V. von Gratowski, V.G. Shavrov, D.Zakharov, Academy of Sciences, Moscow, Russia.
  Presentation

• Circuit edit through copper power plane with halogen
  Lorenzo Motta, ST, Italy.
  Presentation

• Image Processing, Quantification and Model Reconstruction in SEM/FIB - case studies
  Daniel Lichau, Visualization Science Group, Bordeaux, France.
  Presentation

• Structural analysis of through silicon vias (TSV)
  Hugo Bender, Chris Drijbooms, Patricia Van Marcke, Jef Geypen, Olivier Richard, Paola Favia, IMEC, Belgium.
  Presentation

• Focused Ion Beam electrode patterning for nanostructured material-based chemical gas sensor
  Vera La Ferrara, B. Alfano, G. Fiorentino, M. Miglietta, E. Massera, T. Polichetti, G.Di Francia, ENEA, Italy.
  Presentation

Posters

• Nanoimprinted metallic probe demonstrators for electrical scanning probe microscopy: Manufacturing, characterization, and application
  Joachim Jambreck, V. Yanev, H. Schmitt, M. Rommel, A. J. Bauer, L. Frey, Fraunhofer, Germany.
  Poster
• FIB slicing and imaging of palaeopalynological remains: a 3D inside look into the past
  A.Benedetti, J. Mendez, J. B. Diez, U. Villanueva-Amadoz, L. M. Sender, Universidad de Vijo, Spain.
  Poster
• FIB for optoelectronics failure analysis
  Gérald Guibaud, Hélène Chauvin, Vanessa Chazal, Guy Perez, Kevin Sanchez, Philippe Perdu, Thales and CNES, France.
  Poster
• Direct determination of forward sputtering rates and redeposition for Focused Ion Beam milling
  Markus Schinnerl, Bernhard Basnar, Alois Lugstein, Emmerich Bertagnolli, Vienna University of Technology, Austria.
  Poster
• Circuit edit through copper power plane with halogen
  L. Motta, D DiDonato, STMicroelectronics and Sector Technologies.
  Poster
• In-line, non destructive, and direct measurement performed by FIB in semiconductor manufacturing environments  
  F. Giarrizzo, S. Damigella, G. Mazzaglia and D. Mello, ST Microelectronics, Catania, Italy.
  
• Mixed technique for TEM sample preparation on device having SiC substrate
  G. Anastasi, F. Giarrizzo and Domenico Mello
  
• Visualization Sciences Group
  Daniel Lichau
  

Sponsoring