12th European FIB Users Group Meeting (EFUG2008)
Programme and presentations
Monday 29 September 2008, Maastricht, The Netherlands.
Oral presentations
Review lecture
- EFUG: Back in Holland
H. Roberts, B. Otterloo, NXP Semiconductors, Nijmegen, The Netherlands.
Presentation (4656kB, Acrobat format).
Contributed presentations
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Improvements in TEM lamella handling
S. Kleindiek and A. Rummel, Kleindiek Nanotechnik GmbH, Reutlingen, Germany.
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FIB applications off the beaten path: TEM plan-view sample preparation using circuit-edit tools.
F. Voogt, NXP Semiconductors Nijmegen, The Netherlands.
Presentation (5334kB, Acrobat format).
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Backside Circuit Edit on Full-Thickness Silicon Devices
C. Rue, FEI Company, Hillsboro, Oregon, USA ; S. Herschbein, C. Scrudato, IBM Corporation, East Fishkill, NY, USA.
Presentation (2494kB, Acrobat format).
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FIB Milling Applications for the New HyperionTM Ion Source
N. Smith, P. Tesch, N. Martin,
Oregon Physics LLC, Hillsboro, Oregon, USA ;
K. Filter, Semion, Hillsboro, Oregon, USA
; R. Boswell, Australian National University, Canberra, Australia.
Presentation (5508kB, Acrobat format).
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Ion Source Transmission electron microscopy sample preparation employing a "triple" beam instrument
D. Kraft, Carl Zeiss NTS Gmbh, Oberkochen, Germany.
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Customization of Water-Vapour-Assisted FIB Milling on Diamond Technology
S. Magni, A.S. Campbell, E. Gregoryanz, School of Physics and Astronomy, Edinburgh, Great Britain.
Presentation (3202kB, Acrobat format).
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Higher Resistivity Dielectric
V.V. Makarov, T. Malik, R. Jain, T. Lundquist, DCG Systems, USA.
Presentation (382kB, Acrobat format).
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On the gallium accumulation at the boundaries of Al layers in FIB prepared TEM specimens
H. Bender, IMEC, Belgium.
Presentation (1670kB, Acrobat format).
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Remarks on FIB edit and analysis requirements for 65nm IC technologies and below
C. Boit, Berlin University of Technology, Germany.
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NanoDUE'T NB5000 for highspeed 3D failure analysis and TEM sample preparation
R. Schmidt, Hitachi High-Technologies Europe GmbH, Krefeld, Germany.
Best poster award
- New FIB Processing Concept for Nanocarbons
L.G. Lechner, Low Temperature Laboratory, Helsinki University, Finland.
Poster (190kB, Acrobat format).
Sponsoring
The EFUG2008 meeting was kindly sponsored by : Carl-Zeiss, DCG Systems, FEI, Hitachi and Kleindiek.
Contact : European FIB Users Group 