20th European FIB Users Group Meeting (EFUG2016)
20th September 2016, Halle, Germany

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Program

• Ga contamination in silicon by focused ion beam milling: Atom Probe Tomography and simulation with dynamic model
  Jin Huang, TU Dresden
  Presentation
• Micro mechanical robustness tests of 28nm BEOL layer stack
  Eckhard Langer, Globalfoundries
• Laser based sample preparation for advanced packaging applications
  Thomas Höche, Fraunhofer IMWS
  Presentation
• Planar FIB Milling of Copper by using the Novel Rocking Stage Technology
  Sharang Sharang, TESCAN ORSAY HOLDING a.s.
• Fast, Reliable, Intuitive TEM Sample Preparation using a Load-Lockable Platform Combined with Smart Control Software
  Stephan Kleindiek, Kleindiek Nanotechnik GmbH
  Presentation
• Imaging and Analysis Solutions for 3D Devices
  Ingo Schulmeyer, Carl Zeiss Microscopy
• Innovative TEM sample Preparation on Helios G4 platform
  Trevan Landin, FEI
• FIB and P-FIB assisted sample preparation for in-situ TEM characterization
  Remy Berthier, CEA-LETI