19th European FIB Users Group Meeting (EFUG2015)
Program and presentations
Thursday 8th October 2015, Toulouse, France

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Presentations - Conference session

• Focused high- and low-energy ion milling for TEM specimen preparation
  Andriy Lotnyk, D. Poppitz, U. Ross, J.W. Gerlach, F. Frost, S. Bernütz, E. Thelander, B. Rauschenbach, Leibniz Institute of Surface Modification, Leipzig, Germany
  Microelectron. Rel. 55 2119-2125 (2015).
• TEM sample preparation of a SEM cross section using electron beam induced deposition of carbon
  Emanuela Ricci, F. Cazzaniga, S. Testai, STMicroelectronics, Agrate Brianza, Italy
  Microelectron. Rel. 55 2126-2130 (2015).
• Fabrication of advanced probes for atomic force microscopy using focused ion beam
  Oleg A. Ageev, A.S. Kolomiytsev, A.V. Bykov, V.A. Smirnov, I.N. Kots, Southern Federal University, Rostov-on-Don, Russia.
  Microelectron. Rel. 55 2131-2134 (2015).
• Plasma FIB: enlarge your field of view and your field of applications
  Audrey Garnier, G. Filoni, T. Hrncir*, L. Hladik*, STMicroelectronics Cornaredo, Italy, *Tescan Orsay Holding, Brno, Czech Republic.
  Microelectron. Rel. 55 2135-2141 (2015).
• Formation of coupled-cavities in quantum cascade lasers using focused ion beam milling
  Andrzej Czerwinski, M. Pluska, A. Laszcz, J. Ratajczak, K. Pierscinski, D. Pierscinska, P. Gutowski, P. Karbownik, M. Bugajski, Institute of Electron Technology, Warsaw, Poland.
  Microelectron. Rel. 55 2142-2146 (2015).
• Plasma FIB development for 3DIC structures investigations and X-ray tomography sample preparation (invited)
  G. Audoit, B. Delacourt, J. Nasarre, L.M. Djomeni, D. Laloum, P. Bleuet, L. Kwackman*, Université Grenoble Alpes, Grenoble, France, *FEI, Eindhoven, The Netherlands.
  (no published paper).

Presentations - Workshop session

• Failure Analysis in FIB/SEM - Locating Failures and performing Nanoprobing in situ
  Matthias Kemmler, A. Rummel, K. Schock, S, Kleindiek, Kleindiek Nanotechnik, Reutlingen, Germany
  Presentation
• Gas Assisted Plasma FIB Delayering of Advanced Semiconductor Devices
  David Donnet, T. Landin, O. Sidorov, C. Rue, R. Alvis, FEI Company, Hillsboro, USA
  Presentation
• Laser cooled atoms as a focused ion beam source
  Matthieu Viteau, M. Reveillard, D. Comparat*, F. Fuso**, A. Fioretti***, Orsay Physics, Fuveau, France, *CNRS, Orsay, France, **Universita di Pisa, ***Istituto Nazionale di Ottica, Pisa, Italy
• FIB daily business at Infineon
  Peter Meis, Infineon, Germany
• Efficient Sample Prep Workflow with a New Cleaving Methodology
  Efrat Moyal, LatticeGear
  Presentation

Poster session

• FIB device surgery for noise reduction in InGaAs/InP SPAD Arrays
  Lorenzo Motta, C. Savoia, N. Calandri, M. Sanzaro, A. Tosi, STMicroelectronics, Agrate Brianza, Italy.
  Presentation
• Plan-view specimen preparation of device structures with FIB
  P. Van Marcke, H. Bender, O. Richard, P. Favia, Imec, Leuven, Belgium
  Presentation
• Surface redeposition and damage due to Focused ion beam milling
  H. Bender, A. Franquet, C. Drijbooms, B. Parmentier, W. Vandervorst, L. Kwakman*, Imec, Leuven, Belgium, *FEI Company, Eindhoven, The Netherlands
  Presentation

EFUG2015 sponsors

•   FEI Company
•   Kleindiek Nanotechnik 
•   Orsay Physics 
•   Raith Nanofabrication